Panel Discussion during IEDM 2024
December 10th, 2024 | 5:00 – 7:40 PM
THE FUTURE OF ADVANCED PACKAGING
3D is Here, Now What?
You are invited to join us for a reception and panel discussion featuring leading technologists from AMD, Intel, Cadence and Applied Materials. Moderated by industry analyst and YouTube educator Dr. Ian Cutress of More than Moore, this expert panel will explore the future of advanced packaging. Now that the first 3D packaged systems are on the market, what will it take for the industry to move “beyond 3D”? To tap the true potential of AI, we need a new set of packaging building blocks that dramatically increase interconnect density and bandwidth – enabling future systems that bring together multiple types of chiplets, memory and optics in the package to deliver the performance of a monolithic chip.
Please join us for a lively and engaging program!
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Tuesday, December 10th
5:00 PM – 6:30 PM
Guest Check-in and Reception
6:30 PM – 7:40 PM
Panel Session
Hotel Nikko San Francisco
222 Mason Street,
San Francisco, CA 94102
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